 The MultiProbe™ Atomic Force (AFP) combines the lowest noise electrical probing with atomic force microscopy, resulting in the world’ highest resolution probing tool. The AFP is ideal for imaging and contacting deep submicron structures. It features piezoelectric nano-positioning and force feedback to deliver high-resolution maps of nanometer-sized surface structures, and the ability to place up to 6 probes on desired nodes, quickly and with controlled force. The AFP is designed to use ultra-sharp tungsten needles to give the probes an extended lifetime for both imaging and probing. The MultiProbe AFP has been acclaimed for its ability to extract properties at every possible stage of the process, from silicide to final metallization.  Engineers that use the AFP for Failure Analysis report that it has reduced FA processes to such a degree, that, what previously took a week's worth of additional process steps to accomplish, now requires as little time as it takes to pull a wafer at contact or silicide level. How valuable would it be to measure properties, one month, one week or even one day sooner? |
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Trion Technology, Plasma Etch and Deposition Systems Manufactures a wide variety of systems for the Compound Semiconductor, MEMS, Opto-Electronic and other markets. Our products feature the smallest footprint and lowest cost systems in the industry with proven production reliability. If you wish anything from full-blown production cluster tools to a simple laboratory system, Trion makes it.  Sirus T2 Table Top Reactive Ion Etch (RIE) System The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment. 
Phantom III (RIE) system The Phantom III RIE is designed for etching nitrides, oxides and any films or substrates requiring fluorine-based chemistry. It's modular design, mounted on a space-saving platform, is the system of choice for many users throughout the world. For further information, please visit http://www.triontech.com |
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Auto Acid Decapsulator
Safe, Simple, Secure
Packaging technology is constantly changing. We are experiencing increasing requirements for automated acid decapsulation of complex packages. These packages cover a wide range of designs, which can be summarized into the following categories: - High-density micro BGAs
- FPBGAs
- High-density die down BGAs
- Multi-die BGAs
- Stacked Chip BGAs
- CSPs
- Multi-die CSPs
- Stacked Chip CSP
"Radiant Optronics has acquired full distribution rights for Singapore, Malaysia, and Thailand" For Futhur informaton, please visit http://www.nisene.com |
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Reltron Fault Isolation Systems  ICS-1000 PEM Photon Emission Microscope systems flashFMI Fluorescent Micro-thermal Imaging system LIFA Laser Induce scanning Fault Isolation Microscope Solar Inspector System |
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 X-Ray Phase Contrast Imaging
Phase plays an important part in improving contrast for x-ray images with many types of samples. PCX from XRT is specifically designed to capture and retrieve both phase and absorption contrast providing high contrast imaging in the broadest range of applications. 3D MICRO-Tomography The PCX offers full 3D CT volume reconstruction and visualization.In much the same way as a medical CT scanner works,the arrangement of internal features and components can then be analyzed by “virtual slicing” without having to physically dissect the sample. 
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Failure Analysis
