Auto Acid Decapsulator

Safe, Simple, Secure

Packaging technology is constantly changing. We are experiencing increasing requirements for automated acid decapsulation of complex packages. These packages cover a wide range of designs, which can be summarized into the following categories:

High-density micro BGAs
FPBGAs
High-density die down BGAs
Multi-die BGAs
Stacked Chip BGAs
CSPs
Multi-die CSPs
Stacked Chip CSP

"Radiant Optronics has acquired full distribution rights for Singapore, Malaysia, and Thailand"

For Futhur informaton, please visit http://www.nisene.com

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